Patricia A Daniels
Unit 6 Assignment
IDEO’s support structure enables IDEO to be innovative for several reasons. The organization allows its employees to be creative and have a mind of their own. They discourage listening to the boss because they realize that the boss is not always having the best idea. This allows the employees to be free to contribute without being shut down. The people who work at IDEO comes from different educational backgrounds, from engineers to psychology majors to business majors. All the employees are considered equal which is totally opposite of corporate America. Status is who comes up with the best idea and not who has been here the longest. This helps the employees understand that they can contribute equally to the innovation process. The employees are broken down into teams and has a project leader which changes after each project. IDEO’s mantra is not to criticize other’s ideas, stay focused on the topic, one conversation at a time, encourage wild ideas, and build on the ideas of others. They have realized that a fun work place helps to develop creativity.
The culture supports the innovation of the IDEO organization because employees design their own working areas. This helps bring out the creativity in the personnel and show their personality. Employees have interest and skills to work with wide range of people and there are no hierarchies. Another thing that helps bring out the creativity in its employees is the “Swap Program” (Designed Chaos- An interview with David Kelley, founder and CEO of IDEO, 2000). Employees chose any other employee around the world to swap lives with. This opens them up to different cultures and they can return if they wish.
The managing style that is used in IDEO’s Deep Dive is teamwork style. This style motivates the employees by pooling tier knowledge and often the results far exceed expectations. Teams may be able to solve problems more quickly...
References: Designed Chaos- An interview with David Kelley, founder and CEO of IDEO. (2000). Virtual Advisor, p. 5.
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